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Lapping Compounds are available with a wide range of oil, water, and
universal (oil and water soluble) carriers for optimum performance in virtually
all applications where cutting or finishing actions are required. Different
formulations are used to manipulate carrier chemistry and impart specific
properties to the carrier base. To meet varied requirements regarding lubricity and
work-piece contamination issues, lapping compounds are available with Oil
Soluble, Water Soluble and Universally Soluble carrier jellies.
Soluble Compounds provide the greatest flexibility in carrier chemistry,
recommended for applications such as controlled lapping of carbide drawing dies,
cold heading dies and other standard polishing applications.
Soluble Compounds are used where petroleum contamination is forbidden. These are
carefully engineered to ensure the highest lubricity and thermal consistency.
Universally Soluble compounds have been developed to combine the advantages of both oil and water soluble compounds, increasing the versatility of use.
Made strictly in compliance with international standards, our lapping compounds are color coded according to the size of the diamond particles added.
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These lapping compounds are manufactured using the
toughest and most tightly
graded diamond micron powders for
aggressive cutting action and exceptional surface smoothness. These are
available in Low, Standard, and High concentrations, in tightly graded sizes
ranging from 0.25 microns to 80 microns. Packings are
available in 5 gm. syringes as well as 50 gm., 100 gm., 500 gm. and 1 kg. jars.
Packings are available in 5 gm. syringes as well as 50 gm., 100 gm., 500 gm. and 1 kg. jars.
Gem Diamond Products
323 Adhyaru Industrial Estate, Sun Mill Compound, Lower Parel, Bombay 400 013, India.
Tel: + 91 - 22 - 2492 7823 Fax: + 91 - 22 - 2495 2706